| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit substrate structure on which a BGA package is surely mounted without junction failures in solder junctions. SOLUTION: This circuit substrate structure includes a circuit substrate, having a predetermined circuit pattern formed thereon and a BGA package 54 connected electrically to the circuit pattern of the circuit substrate. The BGA package 54 includes a chip carrier substrate 56, a chip 58 mounted on the chip carrier substrate 56, and solder balls connected electrically to the chip 58. The circuit substrate 52 and/or the chip carrier substrate 56 are provided thereon with resist layers 66 and 76. The resist layers 66 and 76 are formed therein with recesses 70 and 78 for accommodating parts of the solder balls therein.</p> |
