| 摘要 |
<p>A polishing apparatus has a turntable (20) with a polishing cloth (5) attached thereto and a top ring (3) for holding and pressing a workpiece (2) to be polished against the polishing cloth (5) under a certain pressure. The polishing apparatus also has a first dressing unit (11) having a contact-type dresser (10) for dressing the polishing cloth (5) by bringing the contact-type dresser (10) in contact with the polishing cloth (5), and a second dressing unit (16) having a noncontact-type dresser (15) for dressing the polishing cloth (5) with a fluid jet applied therefrom to the polishing cloth (5). The contact-type dresser (10) comprises a diamond dresser or an SiC dresser.</p> |
