发明名称 Electrostatic discharge (ESD) protective device for integrated circuit packages with no-connect pins
摘要 An ESD protective device for protection of an integrated circuit (IC) package from electrostatic discharge damage. The ESD protective device protects the internal circuit of the IC connected to wired pins of the IC package against ESD damage due to ESD stress in neighboring no-connect pins. The ESD protective device includes an ESD protective unit coupled to the power bus and a bonding pad coupled between this ESD protective device and the no-connect pin. The ESD protective unit causes ESD stress applied to the no-connect pin to be diverted to the power bus, thus preventing ESD transfer between a no-connect pin and an active pin, which could damage the internal circuit.
申请公布号 US6025631(A) 申请公布日期 2000.02.15
申请号 US19980198876 申请日期 1998.11.24
申请人 WINBOND ELECTRONICS CORP. 发明人 LIN, SHI-TRON
分类号 H01L23/50;H01L23/60;(IPC1-7):H01L23/60;H01L23/48 主分类号 H01L23/50
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