MOLD OF CHIP ARRAY BALL GRID ARRAY PACKAGE AND MOLD CONSTRUCTION OF THE SAME

摘要

PURPOSE: A mold of a chip array ball grid array package and a structure of a mold using the same are provided to prevent an inferior package by forming each boundary groove on a printed circuit board formed with units of a matrix type. CONSTITUTION: A printed circuit board is formed with each unit of a matrix type. A cavity(9) with a predetermined space is formed on a mold(8) for chip array ball grid array package in order to package all units of the printed circuit board. The unit of the printed circuit board(1) and a projection(9') of a lattice shape are formed within the cavity(9) of the mold(8). A multitude of cavity(9) is formed as the matrix type by the projection(9').