发明名称 APPARATUS FOR FORMING MULTILAYER FILM
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for forming a multilayer film wherein a sputtering room can be easily increased or decreased according to the required number of the forming films and the entirety of the apparatus can be arranged compact. SOLUTION: The apparatus comprises a film forming chamber, a transfer mechanism chamber for carrying in or out a substrate on which a film is to be formed, a susceptor containing the substrate, an internal transfer mechanism to rotationally transfer the susceptor placed thereon, a plurality of a single film forming units 111-115 arranged substantially straight, a loader 116 and an unloader 117 carrying in and our respectively the substrate arranged at the both ends of the film forming unit, a vacuum transfer chamber 120 arranged to couple these units and kept in a vacuum therein and a substrate transfer mechanism 118 for transferring the substrate by reciprocating motions.
申请公布号 JP2002203883(A) 申请公布日期 2002.07.19
申请号 JP20000399049 申请日期 2000.12.27
申请人 SHIBAURA MECHATRONICS CORP 发明人 KINOKIRI KYOJI;JO HIDETAKA
分类号 B65G49/00;B65G49/07;C23C14/56;H01L21/203;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G49/00
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