| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which has high reliability and is made compact by an inexpensive and simple method. <P>SOLUTION: The semiconductor apparatus 10 has a semiconductor chip 1 where a photodetecting element is formed, a light-transmissive member 2 opposed to the photodetecting element, an adhesion layer 3 formed enclosing the photodetecting element to bond the semiconductor chip 1 and light-transmissive member 2 to each other, and sealing resin 4 sealing a portion of the semiconductor chip, a side wall of the light-transmissive member 2, and a portion of the adhesion layer 3, wherein the adhesion layer 3 is formed of a thermoplastic adhesive and hole portions 4a are formed penetrating the sealing resin 4 to reach a top surface of the adhesion layer 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
