发明名称 APPARATUS FOR CONDITIONING POLISHING PAD TO EFFECTIVELY ELIMINATE PARTICLES FIRMLY ATTACHED TO PORE OR GROOVE OF POLISHING PAD
摘要 PURPOSE: An apparatus for conditioning a polishing pad is provided to effectively eliminate the particles firmly attached to a pore or a groove of a polishing pad by installing a vibration inducing apparatus in a conditioner. CONSTITUTION: A substrate(130) capable of being transferred by a driving unit(110) is prepared. A roughness forming unit(150) comes in contact with the upper surface of a polishing pad(10) to form predetermined roughness on the upper surface of the polishing pad, installed in the bottom of the substrate. A vibration generating unit generates vibration in the polishing pad, installed in the bottom of the substrate.
申请公布号 KR20050017418(A) 申请公布日期 2005.02.22
申请号 KR20030055129 申请日期 2003.08.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HAH, SANG ROK;LEE, JONG WON;PARK, MOO YONG;SON, HONG SEONG
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址