发明名称 |
APPARATUS FOR CONDITIONING POLISHING PAD TO EFFECTIVELY ELIMINATE PARTICLES FIRMLY ATTACHED TO PORE OR GROOVE OF POLISHING PAD |
摘要 |
PURPOSE: An apparatus for conditioning a polishing pad is provided to effectively eliminate the particles firmly attached to a pore or a groove of a polishing pad by installing a vibration inducing apparatus in a conditioner. CONSTITUTION: A substrate(130) capable of being transferred by a driving unit(110) is prepared. A roughness forming unit(150) comes in contact with the upper surface of a polishing pad(10) to form predetermined roughness on the upper surface of the polishing pad, installed in the bottom of the substrate. A vibration generating unit generates vibration in the polishing pad, installed in the bottom of the substrate.
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申请公布号 |
KR20050017418(A) |
申请公布日期 |
2005.02.22 |
申请号 |
KR20030055129 |
申请日期 |
2003.08.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HAH, SANG ROK;LEE, JONG WON;PARK, MOO YONG;SON, HONG SEONG |
分类号 |
H01L21/304;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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