TEMPORARY WAFER BONDING METHOD FOR SEMICONDUCTOR PROCESSING
摘要
<p>A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a solvent. The film prepared by curing the composition is removable with an etching solution.</p>
申请公布号
WO2006093639(A1)
申请公布日期
2006.09.08
申请号
WO2006US04449
申请日期
2006.02.07
申请人
DOW CORNING CORPORATION;GARDNER, GEOFFREY, BRUCE;HARKNESS, BRIAN, ROBERT