发明名称 |
METHOD FOR WELDING THIN PLATES OF DIFFERENT METAL, JOINED BODY OF THIN PLATES OF DIFFERENT METAL, ELECTRIC DEVICE, AND ELECTRIC DEVICE ASSEMBLY |
摘要 |
A bimetallic thin plate jointing element that is jointed, such that good electric characteristics are maintained, is provided. Thin plate jointing element (10) is formed by welding and jointing positive-electrode terminal (1) and negative-electrode terminal (2) having different melting points, and having flexibility. A plurality of spot-like welding areas (3) formed, for example, by laser welding are provided at overlaid portion (9) of positive-electrode terminal (1) and negative-electrode terminal (2). Welding areas (3) are formed by irradiating laser beams from the side of positive-electrode terminal (1) having a relatively low melting point, and have a cross-sectional shape that is tapered from the side of positive-electrode terminal (1) side toward negative-electrode terminal (2). |
申请公布号 |
EP1779962(A1) |
申请公布日期 |
2007.05.02 |
申请号 |
EP20050739134 |
申请日期 |
2005.05.10 |
申请人 |
NEC CORPORATION;FUJI JUKOGYO KABUSHIKI KAISHA |
发明人 |
HOSOYA, TOSHIZO |
分类号 |
B23K26/20;B23K15/00;B23K26/40;H01M2/02;H01M2/10;H01M2/20;H01R43/02 |
主分类号 |
B23K26/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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