发明名称 Near neutral pH cleaning/activation process to reduce surface oxides on metal surfaces prior to electroplating
摘要 The invention relates to a method for electroplating a metal deposit on electroplatable portions of composite articles that have both electroplatable and non-electroplatable portions. In this method, the invention is an improvement which comprises treating the articles prior to electroplating to provide the electroplatable portions with enhanced electroplatability. This is achieved by passing a current though a near neutral pH solution that contains a conductivity agent and a buffer to reduce or remove surface oxides and contaminants from such portions without deleteriously affecting the non-electroplatable portions of the articles. When the treated surfaces are subsequently subjected to metal plating, a uniform, smooth metal deposit is achieved.
申请公布号 US7270734(B1) 申请公布日期 2007.09.18
申请号 US20040861756 申请日期 2004.06.04
申请人 TECHNIC, INC. 发明人 SCHETTY III, ROBERT A;HWANG, KILNAM
分类号 C25D5/50;C25D5/02;C25D5/34 主分类号 C25D5/50
代理机构 代理人
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