发明名称 Structure and method of forming an enlarged head on a plug to eliminate the enclosure requirement
摘要 The contact opening through an insulating layer is formed having a straight sidewall portion and a bowl shaped sidewall portion. The bowl shaped sidewall portion is near the top of the insulation layer to provide an enlarged diameter of the contact opening at the top relative to the bottom. A conductive material is then formed in the contact opening in electrical contact with a lower conductive layer. The conductive material forms a plug having an enlarged head, such as a nail head or a flat heat screw shape. The enlarged head protects the silicon and a barrier layer, if present, within the contact from being etched by any subsequent anisotropic etches. Thus, when an electrical interconnection layer such as aluminum is formed overlying the contact plug, the plug acts as an etch stop to prevent etching of a barrier layer of the barrier layer within the contact opening.
申请公布号 US7301238(B2) 申请公布日期 2007.11.27
申请号 US20040897222 申请日期 2004.07.22
申请人 STMICROELECTRONICS, INC. 发明人 SMITH GREGORY C.
分类号 C23F1/02;H01L23/48;C23F4/00;H01L21/28;H01L21/302;H01L21/3065;H01L21/768;H01L23/485;H01L23/52;H01L23/522;H01L29/40 主分类号 C23F1/02
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