| 摘要 |
PURPOSE:To provide a component mounting apparatus wherein an electronic component can be mounted on a printed-circuit board at high speed and the reliability of an image processing operation is high. CONSTITUTION:The title apparatus is provided with the following: a tape feeder 23 which feeds an electronic component; a conveyor 24 which conveys a printed- circuit board 7 and feeds it to a prescribed position; an illumination part 30 which is situated between the tape feeder 23 and the printed-circuit board 7 fed to the prescribed position; a suction nozzle 35; and transparent glasses 45, 46. In addition, the title apparatus is provided with the following: a mounting head 29 which sucks a chip component 2a to the tip of the suction nozzle 35 and holds it, which conveys the chip component 2a from the tape feeder 23 to the printed-circuit board 7 while it is being passed over the illumination part 30 and which mounts it on the printed-circuit board 7; and a CCD camera which is arranged in the upper part of the mounting head 29 and which picks up the image of the chip component 2a facedown through the transparent glasses 45, 46 while it is being moved together with the mounting head 29. |
