| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make it possible to form a circuit pattern having a certain thickness or more. <P>SOLUTION: In a production method of a printed circuit board, an injection of a conductive ink in a groove processed by the imprinting method can embody the circuit pattern having a desired thickness, and prevent the bleeding of the conductive ink and the distortion of the pattern in the baking process of the ink containing a metal. The CAD data of the circuit pattern used in fabrication of an imprinting stamper can be reutilized in the inkjet printing process. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
