| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having high flame retardancy without using a flame retardancy giving agent, excellent in moldability, particularly continuous moldability and appearance of a package and excellent in a soldering resistance, and an electronic part apparatus for sealing an element by the curable substance. SOLUTION: The epoxy resin composition for sealing contains (A) an epoxy resin containing a phenol aralkyl type epoxy resin (a1) having a phenylene skeleton, (B) a phenol resin based curing agent containing a phenol aralkyl type phenol resin (b1) having a biphenylene skeleton, (C) an organopolysiloxane (c1) having a carboxyl group and/or a reaction product (c2) of the organopolysiloxane (c1) having the carboxyl group with an epoxy resin, (D) a tolylenediisocyanate modified oxidized wax, and (E) an inorganic filler. A content of the inorganic filler in the whole epoxy resin composition is 84 to 92 wt.%. COPYRIGHT: (C)2008,JPO&INPIT |
