| 摘要 |
A low temperature co-fired ceramic substrate package is provided to mount various components with different sizes and patterns, since a cavity defined between an upper side of a substrate and a wall has a space for mounting at least one component therein. A low temperature co-fired ceramic substrate package comprises a substrate(11), a wall(12), a pad(14), a via(17), a ball grid array(18), and a blind via(19). The wall is deposited in a predetermined height on an edge of upper surface of the substrate, having a cavity(13) that has a space for mounting at least one component. The pad is wire-bonded with a component on the wall. The via is electrically penetrated from the pad to a bottom of the substrate. The ball grid array connects the via on the bottom of the substrate to a printed circuit board. The blind via connects adjacent ball grid arrays. |
