发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a technology which can solve an emerging problem accompanying the narrowing of the pitch of bump electrodes, and can prevent a probe needle from contacting with an adjacent bump needle, in more concrete terms, when the probe needle applies in an electrical property inspection, even if the contact position of the probe needle to the bump electrodes slips out of place, the contact of the probe needle to adjacent bump elctrodes can be prevented. <P>SOLUTION: Bump electrodes 4a-4c are arranged on a line and in the adjacent bump electrodes, they are arranged so that part of region shifts. Electrical property inspection is performed by making the probe needles 6a-6c contact with the shifted region. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008098402(A) 申请公布日期 2008.04.24
申请号 JP20060278480 申请日期 2006.10.12
申请人 RENESAS TECHNOLOGY CORP 发明人 ICHIHARA SEIICHI;OBUCHI ATSUSHI
分类号 H01L21/60;G02F1/1368;H01L21/3205;H01L21/66;H01L23/52 主分类号 H01L21/60
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