摘要 |
<p>A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, so as to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer (3) is formed on a supporting board (2), and a conductive pattern (4) is formed on the insulating base layer (3) so that a number of lines of wire (4a,4b,4c,4d) magnetic head connecting terminals (7), and external connecting terminals (8) are integrally formed and also first through holes (9) are formed in the external connecting terminals (8). Thereafter, after an insulating cover layer (10) is formed, third through holes (20) and second through holes (19) are formed in the supporting board (2) and in the insulating base layer (3), respectively, to communicate with the first through holes (9). This can provide the result that when the external connecting terminals (8) are connected to the external terminals (23), the connection can be performed while confirming the placement of the solder balls (21) by means of the respective through holes.</p> |