发明名称 Wired circuit board comprising terminals for connecting to external terminals through molten metal
摘要 <p>A wired circuit board having terminals that can provide reliable placement of molten metals on the terminals, so as to connect between the terminals and the external terminals with a high degree of precision. An insulating base layer (3) is formed on a supporting board (2), and a conductive pattern (4) is formed on the insulating base layer (3) so that a number of lines of wire (4a,4b,4c,4d) magnetic head connecting terminals (7), and external connecting terminals (8) are integrally formed and also first through holes (9) are formed in the external connecting terminals (8). Thereafter, after an insulating cover layer (10) is formed, third through holes (20) and second through holes (19) are formed in the supporting board (2) and in the insulating base layer (3), respectively, to communicate with the first through holes (9). This can provide the result that when the external connecting terminals (8) are connected to the external terminals (23), the connection can be performed while confirming the placement of the solder balls (21) by means of the respective through holes.</p>
申请公布号 EP1651016(B1) 申请公布日期 2010.01.27
申请号 EP20050021273 申请日期 2005.09.29
申请人 NITTO DENKO CORPORATION 发明人 KANAGAWA, HITOKI;OHSAWA, TETSUYA;OOYABU, YASUNARI
分类号 H05K1/11 主分类号 H05K1/11
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