发明名称 SYSTEMS AND APPARATUS HAVING TOP PORT INTEGRATED BACK CAVITY MICRO ELECTRO-MECHANICAL SYSTEM MICROPHONES AND METHODS OF FABRICATION OF THE SAME
摘要 A micro electro-mechanical system (MEMS) device is provided. The MEMS device includes: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the MEMS device; and a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves. The MEMS device also includes a second substrate coupled to and facing the diaphragm, and including circuitry, wherein the second substrate includes a recess region forming an integrated back cavity in the MEMS device. The MEMS device also includes an electrical connection electrically coupling the first substrate and the second substrate and configured to transmit an electrical signal indicative of the deflection of the diaphragm.
申请公布号 US2016165331(A1) 申请公布日期 2016.06.09
申请号 US201414558911 申请日期 2014.12.03
申请人 INVENSENSE, INC. 发明人 Liu Fang;Lim Martin
分类号 H04R1/08 主分类号 H04R1/08
代理机构 代理人
主权项 1. A micro electro-mechanical system (MEMS) device, comprising: a first substrate having a first surface and a second surface, and a port disposed through the first substrate, wherein the port is configured to receive acoustic waves and wherein the first surface is exposed to an environment outside the MEMS device; a diaphragm coupled to and facing the second surface and configured to deflect in response to pressure differential at the diaphragm in response to the received acoustic waves; a second substrate having a third surface and a fourth surface opposite the third surface, wherein third surface of the second substrate is coupled to and facing the diaphragm, and the second substrate includes circuitry, and wherein the second substrate includes a recess region forming an integrated back cavity in the MEMS device; and an electrical connection electrically coupling the first substrate and the second substrate and configured to transmit an electrical signal indicative of the deflection of the diaphragm.
地址 San Jose CA US