| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for improving cooling performance of a chiller included in a semiconductor device while securing a holding quantity of grease applied to the semiconductor device.SOLUTION: A semiconductor device 2 is formed by laminating a power card 10 for encapsulating a semiconductor element and a chiller 3 across an insulating plate 6. A surface of the power card facing the insulating plate 6 includes a recess for holding grease 9. The recess is narrowed toward an opening from inside.SELECTED DRAWING: Figure 3 |
