发明名称 |
JOINT SYSTEM AND JOINT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To improve the jointing accuracy.SOLUTION: A joint system according to an embodiment comprises a thermal treatment device and a joint device. The thermal treatment device has: a first holding part that holds a first substrate with an electrostatic attraction force; a second holding part that holds a second substrate with an electrostatic attraction force; and a first heating part that heats up the first substrate and the second substrate to a first temperature. The joint device comprises: a third holding part that holds the first substrate with an electrostatic attraction force; a fourth holding part that holds the second substrate with an electrostatic attraction force; a second heating part that heats up the first substrate and the second substrate to a second temperature higher than the first temperature; and a pressurizing part that presses the first substrate and the second substrate by making the third holding part and the fourth holding part relatively approach each other.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016134458(A) |
申请公布日期 |
2016.07.25 |
申请号 |
JP20150007246 |
申请日期 |
2015.01.16 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
KODAMA MUNEHISA;OTSUKA YOSHITAKA;YAMAGUCHI KIYOMITSU;YAMASAKI YUTAKA |
分类号 |
H01L21/02;B23K20/00;H01L21/677;H01L21/683 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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