发明名称 JOINT SYSTEM AND JOINT METHOD
摘要 PROBLEM TO BE SOLVED: To improve the jointing accuracy.SOLUTION: A joint system according to an embodiment comprises a thermal treatment device and a joint device. The thermal treatment device has: a first holding part that holds a first substrate with an electrostatic attraction force; a second holding part that holds a second substrate with an electrostatic attraction force; and a first heating part that heats up the first substrate and the second substrate to a first temperature. The joint device comprises: a third holding part that holds the first substrate with an electrostatic attraction force; a fourth holding part that holds the second substrate with an electrostatic attraction force; a second heating part that heats up the first substrate and the second substrate to a second temperature higher than the first temperature; and a pressurizing part that presses the first substrate and the second substrate by making the third holding part and the fourth holding part relatively approach each other.SELECTED DRAWING: Figure 1
申请公布号 JP2016134458(A) 申请公布日期 2016.07.25
申请号 JP20150007246 申请日期 2015.01.16
申请人 TOKYO ELECTRON LTD 发明人 KODAMA MUNEHISA;OTSUKA YOSHITAKA;YAMAGUCHI KIYOMITSU;YAMASAKI YUTAKA
分类号 H01L21/02;B23K20/00;H01L21/677;H01L21/683 主分类号 H01L21/02
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