| 摘要 |
An adhesive sheet (10) according to the present invention comprises a first region (11) to which an adherend is bonded and a second region (12) provided on an outer periphery of the first region (11), wherein a tensile modulus of elasticity of the first region (11) is smaller than a tensile modulus of elasticity of the second region (12). The adhesive sheet (10) comprises a base film (13) and an adhesive layer (14) laminated on the base film (13), wherein the adherend is a plurality of semiconductor chips (CP), and wherein the first region (11) is provided in a central portion of the sheet in a planar view of the adhesive sheet (10). |
