| 摘要 |
The present invention relates to a MEMS microphone package having an extension back chamber and a manufacturing method thereof, capable of extending the back volume space of a MEMS transducer by using an inner case and preventing damage to a substrate when being welded to an outer case with laser. The MEMS microphone package of the present invention comprises: the substrate (150) having a coupling groove (151); the inner case (140) having a cask shape with one open surface, having connection terminals (142, 143) protruding from the open surface to the side thereof, mounting the MEMS transducer (130) and a readout integrated circuit (120) on the upper surface thereof, and coupled to the coupling groove (151) to form an additional back chamber space between the substrate (150) and the inner case; and the outer case (110) having a cask shape with one open surface, having a portion of the open surface welded to the connection terminals (142, 143) of the inner case, and stacked on the substrate (150) while interposing the inner case (140). Therefore, the back chamber space of the MEMS transducer (130) is extended. The bonding surfaces of the substrate (150) and the outer case (110) are sealed with an adhesive (160) after the outer case (110) is welded to the inner case (140) and not the substrate (150). The MEMS microphone package and the manufacturing method thereof according to the present invention enable the smooth vibration of a vibration plate by additionally extending or forming the additional back chamber space between the inner case and the substrate to maximize the back volume space of the MEMS transducer, thereby improving the sensitivity of a microphone and significantly mitigating noise such as total harmonic distortion (THD). |
