发明名称 BONDING DEVICE
摘要 PURPOSE:To provide a means, by which a pushing tool can be floated from a substrate so that the pushing tool is not made to collide with a semiconductor chip on the substrate at the time of shutdown. CONSTITUTION:The gap of a rotor yoke 5 and a stator yoke 9 is set so that magnetic force between the rotor yoke 5 and stator yoke 9 of a linear motor 4 rotating a horn 1 holding a pushing tool 2 is maximized at a position where the pushing tool 2 is floated from a substrate 13.
申请公布号 JPH0547823(A) 申请公布日期 1993.02.26
申请号 JP19910201671 申请日期 1991.08.12
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ARIKADO KAZUO
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址