| 摘要 |
<p>1,253,708. Semi-conductor devices. MOTOROLA Inc. 6 May, 1969 [28 May, 1968], No. 23001/69. Heading H1K. Apparatus for bonding leads on to the electrodes of semi-conductor dice comprises a frame 10 with a plurality of heavy steel aligning teeth 11 each having a receptacle 12 for receiving the semi-conductor dice in accurate alignment, and a weighted frame 30. During the bonding process a mounting strip 15 is placed in position on frame 10 and rigidly held in position by the teeth 11, the semi-conductor dice are placed in position in the receptacles 12, the lead strip 21 is placed on the frame and accurately located by means of notches 23 which engage indexing studs 24 on the frame, and the weighted frame 30 is placed overall and accurately located by notch 34 engaging stud 36, there being spring fingers 31 passing through apertures 67 to press the lead portions 26 and 27 on lead strip 21 into engagement with the electrode pads of the semiconductor device. The whole apparatus is then placed in an oven and heated to soldering temperature to bond the leads and electrodes together, solder having been provided on the leads and dice for this purpose. After removal from the oven, the dice and lead strips are removed from the apparatus and the leads are severed from the strip. The dice are finally encapsulated in plastics in a known manner, or sealed in a can or a ceramic package.</p> |
