| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent filling failure of sealing resin because of distortion of a base film in a semiconductor package (a COF package, for example). <P>SOLUTION: The COF package includes a flexible base film 20, several metallic inner leads 22 having a thickness of d1 which are arranged on the periphery of an intended place 21 for mounting a semiconductor chip on the base film 20 and are protruded toward the inside of the intended place 21 for mounting the semiconductor chip, dummy metallic patterns 26 having a thickness of d2(<(d1+d3), d3 being the thickness of bump electrodes) which are arranged in predetermined positions within the intended place 21 for mounting the semiconductor chip, the semiconductor chip 30 and the sealing resin 32. The semiconductor chip 30 has several protruded bump electrodes 31 having a thickness of d3 on its major surface which are bonded to the inner leads 22. Further, the sealing resin 32 fills the space between the intended place 21 for mounting the semiconductor chip and the major surface of the semiconductor chip 30. <P>COPYRIGHT: (C)2008,JPO&INPIT |
