| 摘要 |
Nickel plating baths include dimethyl-aminopropyne or its hydrochloride. The bath preferably also includes mono-or bi-nuclear aromatic sulphonic acids, sulphonamides, sulphonimides, or the salts thereof with alkali metals, ammonia, Mg or Ni. Other optional additions include 2 propyne-1-sulphonic acid, sodium alkyl sulphonate, coumarin, boric acid, and alkali metal halides. The nickel salt may be sulphate, chloride, sulphamate, fluoborate, or formate. The sulphonic acid component may be for example, sodium p-chlorbenzene sulphonate, sodium phenyl ethylene sulphonate, o-amino benzene sulphonic acid, sodium p-toluene sulphinate, o-benzoic sulphimide, N:N dicarboxyethyl benzene sulphonamide, 2-naphthol-3, 6-disulphonic acid, sodium thiophene sulphonate, and 2-(4-pyridyl)-ethyl sulphonic acid. |
