| 摘要 |
PURPOSE:To prevent any current leakage due to swelling of extruded conductive adhesive which is applied for mounting an light emitting diode to a lead frame in the manufacturing process of light emitting diode lamp. CONSTITUTION:A mounting section 2 is prepared on the recessed part 11d of a lead frame used for manufacturing a light emitting diode lamp in such a manner that the protruded section will have the upper face whose area is equal to that of the mounting surface for a light emitting diode chip 1 or smaller, and a conductive adhesive 4 is dropped on the upper face of the section 2 to mount the chip 1. Because the adhesive 4 extruding from the lower face of the chip 1 flows over the circumference of the section 2 having a protruded section, no swelling is generated on the side faces of the chip 1, so that the current leakage can be prevented. |
