| 摘要 |
<p>Metals or non-metals are chemically plated with Ni contg. up to 5% W or Mo by adding a molybdate or tungstate to a conventional aq. bath for electroless Ni deposition. Pref. amount molybdate added to bath is 0.005-0.1 (esp. 0.01-0.09) mol/1, and pref. amount tungstate added is 0.01-0.5 (esp. 0.05-0.2) mol/1. Pref. bath contains added citrate, tartrate and/or sugar as complexing agents, and pref. added hypophosphite ions as reducing agents.</p> |
