发明名称 METHOD OF FORMING CIRCUIT PATTERN BY LASER BEAM AND METHOD OF FORMING CONDUCTOR IN THROUGH-HOLE
摘要 PURPOSE:To form a fine circuit pattern easily on a ceramic board positively in a short time by continuously conducting each process of the formation of a conductor pattern, the formation of a through-hole and the formation of a conductor in the through-hole in the method of forming the circuit pattern by utilizing a laser beam. CONSTITUTION:The unnecessary sections 3a, 3b of conductor foils 2a, 2b are removed by irradiating the surface of a ceramic board 1, on which the conductor foils 2a, 2b are laminated, with a laser beam A and desired conductor patterns 4a, 4b are formed on the ceramic board 1, a through-hole 5 is shaped in a position where the electrical joining of both surfaces of the conductor patterns 4a, 4b is required is formed by the irradiation of the laser beam A, and a solder ball 6 is placed at the opening end of the through-hole 5, and irradiated with the laser beam A, thus forming a conductor 7.
申请公布号 JPH0575253(A) 申请公布日期 1993.03.26
申请号 JP19910215455 申请日期 1991.08.27
申请人 HITACHI CONSTR MACH CO LTD 发明人 OGATA KOJIRO;MITSUYANAGI NAOKI;TADA NOBUHIKO;SUZUKI KENICHI;SHIMOMURA YOSHIAKI
分类号 B23K26/00;B23K26/38;B23K101/36;H05K3/00;H05K3/08;H05K3/40 主分类号 B23K26/00
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