| 摘要 |
PURPOSE:To obtain the manufacturing method, of a semiconductor device, wherein, when a die is bonded to a die pad by using a clad-shaped solder foil by a liquid-phase diffusion bonding operation, the thickness of a diffusion layer by a brazing material can be made thin and the mounting treatment time of the die can be shortened and to obtain the semiconductor device manufactured by the method. CONSTITUTION:A layer 4 to be diffused is first formed on the rear of a die 1 by a vapor deposition operation, a plating operation or the like. A diffusion layer 5 is then formed on the other face of the layer 4, to be diffused, which has been formed on the rear of the die 1. The diffusion layer 5 is then brought into contact with the surface of a die pad 3; a heat treatment is executed. Thereby, the die 1 is bonded to the die pad 3. |
