ELECTRONIC CIRCUIT DEVICE FORMED BY USING THE SOLDER

摘要

A solder capable of forming bonds having improved reliability, and an electronic circuit device using such a solder for connecting the component parts thereof. The solder contains Pb, Sb, Ag and Sn in a composition capable of suppressing the low-temperature transformation of the Sn contained therein, suppressing the migration of the Ag contained therein, preventing the development and growth of Sn whiskers, and preventing corrosion.