发明名称 METHOD FOR ANALYZING ORGANIC ADDITIVE IN ELECTROPLATING BATH
摘要 PURPOSE: To measure the quantities of a brightener and leveling agent in an electroplating bath by monitoring the change of the energy output corresponding to a plating process with time by utilizing the difference between the bonding power between the brightener and a metal and that between the level and the metal. CONSTITUTION: Discoid working electrode 1 and counter electrode 2 having small diameters are arranged closely to each other and dipped in an electroplating bath 4 together with a reference electrode 3. The working electrode 1 which brings a current into contact with a sliding brush is rotated by means of a motor 5 and an electronic potentiostat 7 for adjusting energy input between the electrodes 1 and 3 is controlled by means of a computer 6. After the electrode 1 is cleaned by making a constant current to flow through the electrode 1 or chemically treating the electrode 1, a copper thin film is plated by putting a disc in an electroplating bath. Then the current is disconnected and a brightener is absorbed until a balancing potential is stabilized. When electroplating is started in the next stage, the initial potential at the starting time becomes the scale of the brightener and, when the plating is continued and the potential-time curve is plotted, the gradient of the curve indicates the brightener/ leveling agent ratio.
申请公布号 JPH0580028(A) 申请公布日期 1993.03.30
申请号 JP19920049939 申请日期 1992.03.06
申请人 SHIPLEY CO INC 发明人 UEIDO SONNENBAAGU;ROJIYAA BAANAADO;PATORITSUKU HOORU;GOODON FUITSUSHIYAA
分类号 G01N27/416;C25D21/14;G01N27/42 主分类号 G01N27/416
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