发明名称 SOUND SUPPRESSING STRUCTURE WITH THERMAL RELIEF
摘要 <p>SOUND-SUPPRESSING STRUCTURE WITH THERMAL RELIEF Sound-suppressing structure comprising stacked acoustic panels wherein the inner high frequency panel is mounted for thermal expansion with respect to the outer low frequency panel. Slip joints eliminate the potential for thermal stresses, and a thermal expansion gap between the panels provides for additional relative thermal growth while reducing heat convection into the low frequency panel.</p>
申请公布号 CA1087406(A) 申请公布日期 1980.10.14
申请号 CA19770285937 申请日期 1977.09.01
申请人 GENERAL ELECTRIC COMPANY 发明人 NASH, DUDLEY O.;HOLOWACH, JOSEPH
分类号 (IPC1-7):02K1/26 主分类号 (IPC1-7):02K1/26
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