| 摘要 |
PURPOSE:To eliminate a need for supplying a solder to a connecting pad on a wiring board and to prevent a short circuit from being caused even when a lead pitch becomes narrow. CONSTITUTION:A solder bump 5 in a shape that it is passed through a part 2 corresponding to a lead is provided in the part 2, corresponding to the lead, which is formed by etching a Cu film 1 and which is soldered to a connecting pad 13 on a wiring board 12. Thereby, a solder which is used to solder the connecting pad is supplied in advance to the part corresponding to the lead, and its supply amount is set to be a definite amount. |
