| 摘要 |
PURPOSE:To prevent the deformation of internal leads by plating a plurality of internal leads in the state of being joined together at the ends thereof. CONSTITUTION:Parts of an electroconductive thin plate for forming a lead frame between stage supporting bars 3 and a plurality of internal leads 2 are punched away by using a die. In a workpiece thus formed, the respective ends of the stage supporting bars 3 each shaped in a slender strip and the internal leads 2 are joined to a stage forming region 9. Next, the surface of the lead frame on the side whereon a semiconductor chip is mounted is plated. On the occasion, gold, silver or the like is used as a plating material, and plating is conducted with an elastic substance such as a silicon rubber pressed on the opposite-side surface of the frame and used as a mask. |
