CARRIER TAPE FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To avoid deformation and damage by a method wherein a carrier tape has a cavity whose shape matches the outside shape of a semiconductor device and the corners of the semiconductor device package are fixed by parts of the side walls of the cavity or by protruding members. CONSTITUTION:A plurality of cavities 13 which accommodate semiconductor devices 12 are provided in a carrier tape main part 11 with equal intervals. The side walls 13A of the cavity 13 are inclined so as to make the cavity wider toward the opening of the cavity 13. The shape of the cavity 13 is such that notches 13C which have the same shape as the corners of the package 12 are provided at crossing parts of cross-shape boxes 13B. By constructing the cavity 13 like this, the package 12 is fixed in the cavity 13 and the semiconductor device is not turned in the cavity 13 by the application of vibration force produced at the time of transportation of the carrier tape so that deformation and damage of the leads of the semiconductor device can be avoided.