| 摘要 |
PURPOSE:To accelerate the wire bonding speed while increasing the processing capacity of a wire bonder by a method wherein the bonding head holding a bonding tool is made lightweight as well as capable of rapid movement within the title semiconductor manufacturing device (wire bonder). CONSTITUTION:The title semiconductor manufacturing device is equipped with a bonding head 13 holding a bonding tool 5 as well as a camera head 3 holding a camera unit 4 so as to be provided with an independent driving source. |
