发明名称 AN ARRANGEMENT FOR CONNECTING A HYBRID CIRCUIT TO A MOTHER BOARD
摘要 <p>The invention relates to an arrangement for connecting a hybrid circuit to a mother board, the hybrid circuit comprising a printed circuit board (1) of an insulating material, with foils on both sides, components fixed to the printed circuit board, and printed circuit board legs (2) by means of which the hybrid printed circuit board is connected to the mother board. The purpose is to achieve a connection which is maximally easy to manufacture and at the same time electrically and mechanically reliable. To achieve this, the legs of the printed circuit board consist of projections (2) in the board (1) itself, and the mother board has apertures corresponding to the legs, the apertures not being copper-plated throughout, in which case the earth foils and conductor foils in the projections (2) are connected to the foils of the mother board at the edges of the apertures. The apertures in the mother board are preferably oval, corresponding in width to the thickness of the legs (2).</p>
申请公布号 EP0303975(A3) 申请公布日期 1990.07.18
申请号 EP19880113079 申请日期 1988.08.11
申请人 NOKIA-MOBIRA OY 发明人 VAISANEN, RISTO
分类号 H01R12/52;H05K1/02;H05K1/14;H05K3/36;(IPC1-7):H01R9/09 主分类号 H01R12/52
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