| 摘要 |
<p>PURPOSE:To suitably align a wafer and to further set a cutting region of the wafer to a minimum limit by providing a shape recognition part, recognizing a wafer shape, aligning and cutting it. CONSTITUTION:Shape recognition means 10 of a wafer W for recognizing the profile shape of the wafer W is provided, and the wafer is aligned and cut based on the shape of the recognized wafer W. That is, the shape of the wafer is recognized at each wafer, a reference pattern position is suitably decided based on the recognized shape, and a cutting region is decided based on the recognized wafer shape. Thus, since a suitable alignment can be executed and a minimum cutting region is obtained, high throughput of dicing can be performed.</p> |
