METHOD FOR PLUGGING PIPELINE PUNCTURES

摘要

The method is applied in the field of heat engineering, shipbuilding and mechanical engineering. It patches leaking holes in pipelines operating at higher temperatures and does not require halt in pipelines' operation. A pad is placed on the leaking hole and is pressed with brackets until the leakage stops. A metallic lamella or a cup is fitted between the pad and the clamps. The lamella covers the pad completely and steps onto the pipeline. Then the lamella is soldered at a temperature, approximating that of the pipeline. Then solder composition in wt. percent is as follows: tin 10-35, indium 20-60, cadmium 7-25 and copper powder 10-40. The soldering zone is subject to ultrasonic treatment and, if necessary, additional local heating.