发明名称 |
Paddleless molded plastic semiconductor chip package |
摘要 |
A semiconductor package and method in which a semiconductor chip is mounted within an opening of a lead frame by bonding wires extending between an active front side of the chip and bonding pads of the lead frame; the lead frame/chip assembly is encased within a plastic molded body, with an inactive back surface of the semiconductor chip exposed and facing outside the package. <MATH> <MATH> |
申请公布号 |
EP0690499(A2) |
申请公布日期 |
1996.01.03 |
申请号 |
EP19950304597 |
申请日期 |
1995.06.29 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
HAMBURGEN, WILLIAM RIIS;DORDI, YEZDI NAVAL;FITCH, JOHN STUART |
分类号 |
H01L21/56;H01L23/31;H01L23/433;H01L23/495;H01L33/54;H01L33/64 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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