| 摘要 |
<p>Method for encapsulating, in a mould (48a,48b), an electronic component (30) having a number of laterally projecting elongated connecting elements (33) situated next to one another in one plane, said connecting elements being without metallic through connection and having a certain mutual pitch (PL), width (WL) and height (TL), and with the insertion of two films (8a,8b), each having a predetermined thickness (TFT and TFB, respectively), a deformable film being used and the encapsulation being carried out under conditions which are such that, during the process, the condition <MATH> at the position of the clamping edges of the matrix parts, while <MATH></p> |
