| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame applicable to a full-sealed package operating on high frequencies and capable of enhancing signal terminals in isolation from each other. SOLUTION: Signal terminals 8, 9, and 12, 13 out of signal terminals 1, 4, 6, 8, 9, 12, 13, 15, 17, and 20 are combined into a single terminal respectively inside a package so as to obtain an input impedance in a microwave band. The signal terminals 8, 9 and 12, 13 are surrounded with grounding terminals 7, 10, and 11, 14, and the grounding terminals 10 and 11 are located at an outermost side. On the other hand, a semiconductor chip 22 is bonded to a mount island 21 with a mount material and connected to leads with bonding wires 23, and the semiconductor chip and the others are sealed up together with sealing resin for the formation of a lead frame. As mentioned above, the same signal terminal is sandwiched between grounding leads formed in one piece with the mount island 21 inside the package, and the grounding terminals are formed of the outermost terminals, whereby signal terminals can be well isolated from each other.
|
