| 摘要 |
PURPOSE: An apparatus for polishing a semiconductor wafer is provided to enhance a productivity and reduces a production cost by differing total structures, and polishes many wafers at one time. CONSTITUTION: An apparatus for polishing a semiconductor wafer includes a wafer fixing stand(11), a wafer receipt load(12), a first polishing plate(14), a second polishing plate(15), a first slurry providing part(16), a second slurry providing part(17), and a third slurry providing part(18). Many wafer receipt grooves are formed on the wafer-fixing stand. The wafer receipt load is mounted to the wafer fixing stand so as to be vertically moved, receives a wafer, and places the wafer in a receipt groove of each wafer. The first polishing plate is horizontally moved on one side of the wafer fixing stand, is rotatably mounted, and polishes a wafer received in each wafer-receiving groove of the wafer-fixing stand. The second polishing plate is horizontally moved on the other side of the wafer fixing stand, is rotatably mounted, and polishes the wafer received in each wafer-receiving groove of the wafer-fixing stand. The first slurry providing part is mounted on the wafer-fixing stand, is horizontally moved, and provides slurry on the wafer received in each wafer-receiving groove. The second slurry providing part is positioned on the upper part of the first polishing plate, and provides slurry on the first polishing plate. The third slurry providing part is positioned on the second polishing plate, is horizontally moved, and provides slurry on the second polishing plate.
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