| 摘要 |
A first conductive pattern having a pitch of not more than a predetermined pitch is formed on a main surface of a thin flexible substrate. In addition, a second conductive pattern having a pitch of not less than the predetermined pitch is formed on a rear surface of the substrate. A through hole is formed so as to be enclosed by respective parts of the areas, mainly, land areas at edge portions, of the conductive patterns and has openings at both front and rear sides of the substrate. In the through hole, a high viscosity conductive material formed by screen printing from the main surface side of the flexible substrate and a low viscosity conductive material formed by screen printing from the rear surface side contact each other. Accordingly, a via connection structure is formed.
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