| 摘要 |
A semiconductor manufacturing system of the present invention includes exposure value detection means for detecting an exposure value, pattern size detection means for detecting a pattern size, size comparison means for calculating a size difference between the pattern size and a target value, optimum exposure value calculation means for calculating an optimum exposure value based on the exposure value and the size difference, and an exposure value control means. In the semiconductor device manufacturing method of the present invention, the optimum exposure value is calculated based on the exposure value and the size difference, and exposure is performed at the optimum exposure value. A semiconductor device of the present invention is manufactured by the manufacturing method. |
