发明名称 Electronic component with at least one semiconductor chip and method for producing the electronic component
摘要 An electronic component having at least one semiconductor chip, a rewiring layer connected to the semiconductor chip, and a printed circuit board associated with the rewiring layer. The rewiring layer is provided with flexible contacts that correspond with contact faces of the printed circuit board, and the rewiring layer is solidly connected to the printed circuit board via a flat intermediate layer. A method for producing the electronic component is described.
申请公布号 US6807064(B2) 申请公布日期 2004.10.19
申请号 US20020236895 申请日期 2002.09.06
申请人 INFINEON TECHNOLOGIES AG 发明人 HEDLER HARRY;MEYER THORSTEN
分类号 H01L21/60;H01L23/31;H01L23/48;H01L23/485;(IPC1-7):H05K7/10;H05K7/12 主分类号 H01L21/60
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