| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive surface acoustic wave device for coping with downsizing, a low profile, and a sophisticated communication apparatus or the like, with respect to the surface acoustic wave device having at least one piezoelectric vibrator and one connection section arranged on a surface acoustic wave substrate. SOLUTION: Each of principal faces of the surface acoustic wave substrate 1 an IDT electrode section 4 and the connection section 6, and an IDT electrode 5 and the connection section 7, and resin films 2, 3, the resin film 2 covering the one principal face and the resin film 3 covering the other principal face. Further, the resin films 2, 3 include wiring patterns 17, 18 on the face toward the surface acoustic wave substrate 1. The resin films 2, 3 seal the surface acoustic wave substrate 1 and to both ends of which the wiring patterns 17, 18 are electrically connected. COPYRIGHT: (C)2005,JPO&NCIPI
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