WIRING STRUCTURE IN ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a structure of electronic apparatus which enables soldering with an apparatus case for the grounding from the electronic apparatus allocating surface in an electronic apparatus including a built-in single-sided printed circuit board. SOLUTION: The single-sided printed circuit board 11 is provided with the printed wiring surface thereof provided opposed to the bottom plate within a case body 12. At the circumference edge (near the side plate 12B) of the electronic component allocating surface of the printed circuit board 11, a plurality of jumper wires for the grounding 13 (TA lines) are provided through insertion from the electronic component allocating surface. The earth wire is formed through electrical connection of this jumper wire 13 to the case body 12 (side plate 12B) with the soldering. COPYRIGHT: (C)2005,JPO&NCIPI