| 摘要 |
PROBLEM TO BE SOLVED: To reduce a difference in level of a surface of a substrate after forming a conductive layer to evenly planarize the surface of the substrate by polishing. SOLUTION: On the substrate 1 having a first region 31 and a second region 33, a first conductive layer 11 whose surface is higher in the second region 33 than in the first region 31 is formed by electrolytic plating. In order to reduce a difference in level of the surface of the first conductive layer 11 between the first region 31 and the second region 33, a second conductive layer 21 which is thicker in the second region 33 than in the first region 31 is formed by electrolytic plating. COPYRIGHT: (C)2005,JPO&NCIPI
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